Lam Research Corporation (LRCX) : The consensus price target for Lam Research Corporation (LRCX) is $93.9 for the short term with a standard deviation of $4.33. The most optimist securities analyst among the 10 who monitor the stock believes that the stock can reach $100, however, the pessimist price target for the company is $85.
Lam Research Corporation (LRCX), A increase of 686,950 shares or 2.3% was observed in the short interest of Lam Research Corporation The interest on June 30,2016 came in at 31,070,030 shares and as per the average daily trading of 2,803,065 shares, the days to cover are 11. The increased interest is 19.6% of the floated shares. The data of June 15,2016 put the interest at 30,383,080 shares. The information was released by Financial Industry Regulatory Authority, Inc (FINRA) on June 12th.
Lam Research Corporation (NASDAQ:LRCX): On Thursdays trading session , Opening price of the stock was $89.51 with an intraday high of $89.75. The bears continued to sell at higher levels and eventually sold the stock down to an intraday low of $87.82. However, the stock managed to close at $87.88, a loss of 0.84% for the day. On the previous day, the stock had closed at $88.62. The total traded volume of the day was 2,462,797 shares.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.