KLA-Tencor Corporation (KLAC) : 1 brokerage houses believe that KLA-Tencor Corporation (KLAC) is a Strong Buy at current levels. 4 analysts believe that the current prices are in a balance with the stocks fundamentals, hence they propose Hold on KLA-Tencor Corporation (KLAC). Zacks Investment Research suggests a Hold with a rank of 3.The median of all the 5 Wall Street Analysts endorse the stock as a Hold with a rating of 2.6.
KLA-Tencor Corporation (KLAC) : Average target price received by KLA-Tencor Corporation (KLAC) is $72 with an expected standard deviation of $9.41. The most aggressive target on the stock is $80, whereas the most downbeat target is $59. 5 financial analysts are currently covering the stock.
Also, Cowen & Co. upgrades its view on KLA-Tencor Corporation (NASDAQ:KLAC) according to the research report released by the firm to its investors. The shares have now been rated Outperform by the stock experts at the ratings house. Earlier, the shares had a rating of Market Perform. The rating by the firm was issued on August 29, 2016.
KLA-Tencor Corporation (NASDAQ:KLAC): After opening at $68.75, the stock dipped to an intraday low of $68.75 on Thursday. However, the bulls stepped in to buy at lower levels and pushed the stock higher. The stock touched an intraday high of $70.41 and the buying power remained strong till the end. The stock closed at $70.26 for the day, a gain of 1.97% for the day session. The total traded volume was 2,449,557. The stocks close on the previous trading day was $68.9.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.