Tessera Technologies Inc (TSRA): Robert J Andersen , Executive VP and CFO of Tessera Technologies Inc sold 21,521 shares on Sep 20, 2016. The Insider selling transaction was reported by the company on Sep 22, 2016 to the Securities and Exchange Commission. The shares were sold at $35.00 per share for a total value of $753,235.00 , the company said in a SEC Form 4 Filing.
Other Insider transactions have been reported by the company according to SEC Form 4, on Sep 14, 2016, Thomas A Lacey (CEO) sold 40,000 shares at $33.15 per share price.On Sep 14, 2016, Robert J Andersen (Executive VP and CFO) sold 8,000 shares at $33.15 per share price.Also, On Aug 19, 2016, George Andrew Riedel (director) sold 4,500 shares at $32.68 per share price.On Aug 12, 2016, John Chenault (director) sold 15,000 shares at $32.25 per share price.
Tessera Technologies: On Tuesday, Sep 21, 2016 heightened volatility was witnessed in Tessera Technologies which led to swings in the share price. The shares opened for trading at $33.71 and hit $35.49 on the upside , eventually ending the session at $35.28, with a gain of 5.38% or 1.8 points. The heightened volatility saw the trading volume jump to 10,43,191 shares. The 52-week high of the share price is $37.87 and the company has a market cap of $1,714 M . The 52-week low of the share price is at $26.21.
Tessera Technologies Inc. is a holding company. The Company operates its business through its subsidiaries which include Invensas Corporation (Invensas) which is engaged in semiconductor interconnect innovation and intellectual property licensing and FotoNation Limited (FotoNation) which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions and products and solutions for mobile and imaging including its LifeFocus FaceTools FacePower FotoSavvy DigitalAperture face beautification red-eye removal high dynamic range autofocus panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Companys 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.