KLA-Tencor Corp (KLAC) was Reiterated by Cowen to “Market Perform” according to the research note released today. The brokerage firm has raised the Price Target to $ 70 from a previous price target of $67 . Cowen advised their investors in a research report released on Apr 27, 2016.
On the company’s financial health, KLA-Tencor Corp reported $1.15 EPS for the quarter, beating the analyst consensus estimate by $ 0.18 according to the earnings call on Apr 26, 2016. Analyst had a consensus of $0.97. The company had revenue of $712.00 million for the quarter, compared to analysts expectations of $721.06 million. The company’s revenue was down -3.5 % compared to the same quarter last year.During the same quarter in the previous year, the company posted $0.84 EPS.
KLA-Tencor Corp closed down -0.09 points or -0.13% at $71.9 with 7,41,352 shares getting traded on Friday. Post opening the session at $72.05, the shares hit an intraday low of $71.66 and an intraday high of $72.57 and the price fluctuated in this range throughout the day.Shares ended Friday session in Red.
In a different news, on Feb 10, 2016, Brian M. Trafas (SVP, Global Customer Org.) sold 3,057 shares at $64.60 per share price. According to the SEC, on Feb 10, 2016, Michael Kirk (Executive Vice President) sold 3,844 shares at $64.60 per share price. On Feb 10, 2016, Bobby R Bell (Executive Vice President) sold 3,844 shares at $64.60 per share price, according to the Form-4 filing with the securities and exchange commission.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company’s products are also used in various other industries including the light emitting diode (LED) and data storage industries as well as general materials research. KLA-Tencor’s products and services are used by bare wafer integrated circuit (IC) lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness surface topography and composition measurements; measurement of in-chamber process conditions wafer shape and stress metrology; computational lithography tools and overall yield and fab-wide data management and analysis systems.