Electro Scientific Industries Inc (ESIO) Files Form 4 Insider Selling : Paul R Oldham Sells 5,082 Shares

Electro Scientific Industries Inc (ESIO): Paul R Oldham , CFO, Sr. VP of Finance of Electro Scientific Industries Inc sold 5,082 shares on May 16, 2016. The Insider selling transaction was reported by the company on May 16, 2016 to the Securities and Exchange Commission. The shares were sold at $6.91 per share for a total value of $35,143.05 , the company said in a SEC Form 4 Filing.

Other Insider transactions have been reported by the company according to SEC Form 4, on May 16, 2016, Bing-fai Wong (VP, Customer Operations) sold 10,000 shares at $7.11 per share price.On Mar 1, 2016, John K Medica (director) purchased 1,845 shares at $7.05 per share price.Also, On Dec 3, 2015, Kerry L Mustoe (VP, Corporate Controller & CAO) sold 3,498 shares at $5.07 per share price.On Nov 25, 2015, Raymond A Link (director) purchased 4,000 shares at $5.00 per share price.

Shares of Electro Scientific Industries (ESIO) ended Friday, May 13, 2016 session in red amid volatile trading. The shares closed down -0.1 points or -1.41% at $7.01 with 1,43,247 shares getting traded. Post opening the session at $7.09, the shares hit an intraday low of $6.975 and an intraday high of $7.12 and the price vacillated in this range throughout the day. The company has a market cap of $218 M and the number of outstanding shares has been calculated to be 3,11,27,287 shares. The 52-week high of Electro Scientific Industries is $7.5575 and the 52-week low is $4.09.

Electro Scientific Industries Money Flow Index Chart

Company has been under the radar of several Street Analysts.Electro Scientific Industries is Reiterated by Needham to Buy and the brokerage firm has raised the Price Target to $ 9 from a previous price target of $8 .The Rating was issued on May 11, 2016.

Electro Scientific Industries Inc. is a supplier of laser-based manufacturing solutions for the micro technology industry. The Company operates in two segments Component Processing and Micromachining. Its Component Processing segment includes interconnect products semiconductor products and component products. Interconnect semiconductor and component products are sold to manufacturers of electronic components and are used to drill cut trim ablate and test. The Company’s micromachining products are sold to manufacturers of end devices across multiple industries and are used to drill cut or mark features on a range of materials generally on the casing or external surface of the end device. The Company’s integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials.

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