Kulicke and Soffa Industries (KLIC) reported quarterly earnings results on Wednesday, May-4-2016. The company said it had a profit of $0.07 Earnings per Share for the quarter. The results exceeded Wall Street expectations beating the analyst consensus estimate by $0.01. Analysts had a consensus of $0.06. The company posted revenue of $156.40 million in the period, compared to analysts expectations of $135.00 million. The company’s revenue was up 7.7% compared to the same quarter last year. During the same quarter in the previous year, the company posted $0.10 EPS.
Kulicke and Soffa Industries opened for trading at $10.72 and hit $10.98 on the upside on Monday, eventually ending the session at $10.79, with a gain of 0.65% or 0.07 points. The heightened volatility saw the trading volume jump to 4,25,653 shares. Company has a market cap of $759 M.
In a different news, on Feb 5, 2016, Brian R Bachman (director) sold 833 shares at $12.00 per share price. According to the SEC, on Feb 5, 2016, Jonathan Chou (Interim CEO, CFO) sold 4,900 shares at $12.00 per share price. On Dec 8, 2015, Peter T M Kong (director) sold 7,453 shares at $11.83 per share price, according to the Form-4 filing with the securities and exchange commission.
Kulicke and Soffa Industries Inc. (K&S) designs manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices including integrated circuits (IC) high and low powered discrete devices light-emitting diodes (LEDs) and power modules. The Company also service maintain repair and upgrade its equipment. Its customers consist of semiconductor device manufacturers outsourced semiconductor assembly and test providers (OSATs) other electronics manufacturers and automotive electronics suppliers. The Company operates in two business segments: Equipment and Expendable Tools. The Companys Equipment segment manufactures and sells a line of ball bonders heavy wire wedge bonders and wafer level bonders. Expendable Tools segment manufactures and sells a variety of expendable tools for a range of semiconductor packaging applications. Its Expendable Tools segment products include: capillaries bonding wedges and dicing blades.