Kulicke & Soffa Industries Inc (KLIC): Brian R Bachman , director of Kulicke & Soffa Industries Inc sold 845 shares on May 4, 2016. The Insider selling transaction was reported by the company on May 5, 2016 to the Securities and Exchange Commission. The shares were sold at $12.25 per share for a total value of $10,351.25 , the company said in a SEC Form 4 Filing.
Other Insider transactions have been reported by the company according to SEC Form 4, on Feb 5, 2016, Brian R Bachman (director) sold 833 shares at $12.00 per share price.On Feb 5, 2016, Jonathan Chou (Interim CEO, CFO) sold 4,900 shares at $12.00 per share price.Also, On Dec 8, 2015, Peter T M Kong (director) sold 7,453 shares at $11.83 per share price.On Oct 8, 2015, Garrett E Pierce (director) sold 1,322 shares at $9.41 per share price.
Kulicke and Soffa Industries: On Wednesday, May 4, 2016 heightened volatility was witnessed in Kulicke and Soffa Industries which led to swings in the share price. The shares opened for trading at $12.2 and hit $12.3 on the upside , eventually ending the session at $11.34, with a gain of 1.61% or 0.18 points. The heightened volatility saw the trading volume jump to 9,82,103 shares. The 52-week high of the share price is $15.68 and the company has a market cap of $798 M . The 52-week low of the share price is at $8.8.
Kulicke and Soffa Industries Inc. (K&S) designs manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices including integrated circuits (IC) high and low powered discrete devices light-emitting diodes (LEDs) and power modules. The Company also service maintain repair and upgrade its equipment. Its customers consist of semiconductor device manufacturers outsourced semiconductor assembly and test providers (OSATs) other electronics manufacturers and automotive electronics suppliers. The Company operates in two business segments: Equipment and Expendable Tools. The Companys Equipment segment manufactures and sells a line of ball bonders heavy wire wedge bonders and wafer level bonders. Expendable Tools segment manufactures and sells a variety of expendable tools for a range of semiconductor packaging applications. Its Expendable Tools segment products include: capillaries bonding wedges and dicing blades.