Rogers Corp (ROG) Files Form 4 Insider Selling : Gary M Glandon Sells 1,500 Shares

Rogers Corp (ROG): Gary M Glandon , VP, and Chief HR Officer of Rogers Corp sold 1,500 shares on May 4, 2016. The Insider selling transaction was reported by the company on May 5, 2016 to the Securities and Exchange Commission. The shares were sold at $63.99 per share for a total value of $95,988.45 , the company said in a SEC Form 4 Filing.

Other Insider transactions have been reported by the company according to SEC Form 4, on Mar 8, 2016, Jeffrey M Grudzien (VP, Advanced Circuit Materials) sold 1,450 shares at $57.50 per share price.On Mar 7, 2016, Robert G Paul (director) sold 1,700 shares at $55.46 per share price.Also, On Aug 24, 2015, Carol R Jensen (director) sold 800 shares at $58.19 per share price.On Aug 11, 2015, Bruce D. Hoechner (CEO) purchased 800 shares at $58.88 per share price.

Shares of Rogers Corporation (ROG) ended Wednesday, May 4, 2016 session in red amid volatile trading. The shares closed down -2.02 points or -3.17% at $61.79 with 2,26,251 shares getting traded. Post opening the session at $64.22, the shares hit an intraday low of $61.39 and an intraday high of $64.8 and the price vacillated in this range throughout the day. The company has a market cap of $1,110 M and the number of outstanding shares has been calculated to be 1,79,69,554 shares. The 52-week high of Rogers Corporation is $74.56 and the 52-week low is $41.92.

Rogers Corporation Money Flow Index Chart

Company has been under the radar of several Street Analysts.Rogers Corporation is Initiated by Drexel Hamilton to Buy. The Rating was issued on Mar 11, 2016.

Rogers Corporation is a supplier of specialty materials products. The Company supplies products across a range of end markets including portable communications communications infrastructure consumer electronics mass transit automotive defense and clean technology. The Company operates through segments: Printed Circuit Materials (PCM) High Performance Foams (HPF) Power Electronics Solutions (PES) and Others. The Printed Circuit Materials segment includes printed circuit board laminate products for high frequency and high performance applications. The High Performance Foams segment includes polyurethane and silicone foam as well as solid products manufactured in roll stock sheet and molded formats. The Power Electronics Solutions segment consists of direct bond copper (DBC) ceramic substrate products and busbar power distribution products. The Other segment consists of elastomer components floats and inverter distribution activities.

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