Tessera Technologies (TSRA) reported quarterly earnings results on Monday, May-2-2016. The company said it had a profit of $0.48 Earnings per Share for the quarter. The results exceeded Wall Street expectations beating the analyst consensus estimate by $0.04. Analysts had a consensus of $0.44. The company posted revenue of $60.00 million in the period, compared to analysts expectations of $57.73 million. The company’s revenue was down -24.9% compared to the same quarter last year. During the same quarter in the previous year, the company posted $0.74 EPS.
Tessera Technologies opened for trading at $29.76 and hit $30.14 on the upside on Wednesday, eventually ending the session at $30.01, with a gain of 0.98% or 0.29 points. The heightened volatility saw the trading volume jump to 5,14,406 shares. Company has a market cap of $1,510 M.
In a different news, on Mar 9, 2015, George Cwynar (director) sold 3,516 shares at $39.72 per share price. According to the SEC, on Mar 3, 2015, Peter A Feld (director) sold 375,000 shares at $41.08 per share price. On Feb 18, 2015, Timothy J Stultz (director) sold 14,493 shares at $39.22 per share price, according to the Form-4 filing with the securities and exchange commission.
Tessera Technologies Inc. is a holding company. The Company operates its business through its subsidiaries which include Invensas Corporation (Invensas) which is engaged in semiconductor interconnect innovation and intellectual property licensing and FotoNation Limited (FotoNation) which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions and products and solutions for mobile and imaging including its LifeFocus FaceTools FacePower FotoSavvy DigitalAperture face beautification red-eye removal high dynamic range autofocus panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Companys 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.