Company Shares of Advanced Semiconductor Engineering Drops by -2.87%

Advanced Semiconductor Engineering (NYSE:ASX) has tumbled 2.87% during the past week, however, the bigger picture is still very bullish; the stocks have advanced and posted positive gains of 19.96% in the last four weeks. The stocks have underperformed the S&P 500 by 1.71% during the past week but Advanced Semiconductor Engineering (NYSE:ASX) it has outperformed the index in 4 weeks by 18.86%.

Advanced Semiconductor Engineering (NYSE:ASX): During Fridays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $5.45 and $5.39 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $5.49. The buying momentum continued till the end and the stock did not give up its gains. It closed at $5.41, notching a gain of 0.37% for the day. The total traded volume was 2,176,705 . The stock had closed at $5.39 on the previous day.

The company shares have dropped -21.48% from its 1 Year high price. On Jun 22, 2015, the shares registered one year high at $6.99 and the one year low was seen on May 19, 2016. The 50-Day Moving Average price is $5.11 and the 200 Day Moving Average price is recorded at $5.38.

Many analysts have stated their opinion on the company shares. Major Brokerage house, UBS upgrades its ratings on Advanced Semiconductor Engineering (NYSE:ASX). According to the latest information available, the shares are now rated Buy by the analysts at the agency. Previously, the analysts had a Neutral rating on the shares. The rating by the firm was issued on May 31, 2016. Currently the company Insiders own 22.9% of Advanced Semiconductor Engineering shares according to the proxy statements. Institutional Investors own 7.23% of Advanced Semiconductor Engineering shares.

Advanced Semiconductor Engineering, Inc. is an independent provider of semiconductor packaging and testing services. The Company packages bare semiconductors into finished semiconductors with enhanced electrical and thermal characteristics, provides testing services, including front-end engineering testing, wafer probing and final testing services, and provides electronics manufacturing services. It also engages in other activities, such as substrate production and real estate business. The Company operates through the following segments: Packaging, Testing and Electronic Manufacturing Services. The Company offers a range of package types to meet the requirements of its customers, with a focus on advanced packaging solutions. The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, testing and test-related services. It provides integrated solutions for electronic manufacturing services.

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