Lam Research Corporation (NASDAQ:LRCX) has climbed 0.63% in the past week and advanced 8.1% in the last 4 weeks. In the past week, the company has outperformed the S&P 500 by 1.84% and the outperformance has advanced to 7.11% for the last 4 weeks period.
Lam Research Corporation (NASDAQ:LRCX): During Fridays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $82.51 and $81.74 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $82.90. The buying momentum continued till the end and the stock did not give up its gains. It closed at $82.89, notching a gain of 0.27% for the day. The total traded volume was 2,362,474 . The stock had closed at $82.67 on the previous day.
The company shares have dropped -0.93% from its 1 Year high price. On Jun 25, 2015, the shares registered one year high at $84.34 and the one year low was seen on Sep 24, 2015. The 50-Day Moving Average price is $78.85 and the 200 Day Moving Average price is recorded at $76.57.
On the companys insider trading activities, According to the information disclosed by the Securities and Exchange Commission in a Form 4 filing, the officer (President and CEO) of Lam Research Corp, Anstice Martin B had sold 7,948 shares worth of $587,357 in a transaction dated October 26, 2015. In this transaction, 7,948 shares were sold at $73.9 per share.
Many analysts have stated their opinion on the company shares. RBC Capital initiates coverage on Lam Research Corporation (NASDAQ:LRCX) The brokerage firm has issued a Outperform rating on the shares. The Analysts at the ratings agency announces the price target to $92 per share. The rating by the firm was issued on March 16, 2016. Currently the company Insiders own 0.43% of Lam Research Corporation shares according to the proxy statements. Institutional Investors own 98.98% of Lam Research Corporation shares.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.