Electro Scientific Industries (NASDAQ:ESIO) has shown a drop of 3.3% or 9,311 shares in the short positions. The bets have increased to 275,678 shares on June 15,2016 from 284,989 shares on May 31,2016. With respect to the floated shares, the shorts are 0.9%. The days to cover are calculated to be 2, using the standard per day volume of 117,753 shares. The information was released by Financial Industry Regulatory Authority, Inc (FINRA) on June 24th after market close.
Electro Scientific Industries (NASDAQ:ESIO): The stock opened at $5.97 on Friday but the bulls could not build on the opening and the stock topped out at $6.22 for the day. The stock traded down to $5.90 during the day, due to lack of any buying support eventually closed down at $5.93 with a loss of -3.73% for the day. The stock had closed at $6.16 on the previous day. The total traded volume was 2,710,984 shares.
The company shares have rallied 12.31% from its 1 Year high price. On Apr 18, 2016, the shares registered one year high at $7.56 and the one year low was seen on Aug 26, 2015. The 50-Day Moving Average price is $6.70 and the 200 Day Moving Average price is recorded at $6.51.
Electro Scientific Industries (NASDAQ:ESIO) has tumbled 1% during the past week and has dropped 15.17% in the last 4 week period. The company has outperformed the S&P 500 by 0.64% in the past week but underperformed the index by 12.6% in the last 4 weeks.
Electro Scientific Industries, Inc. is a supplier of laser-based manufacturing solutions for the micro technology industry. The Company operates in two segments, Component Processing and Micromachining. Its Component Processing segment includes interconnect products, semiconductor products and component products. Interconnect, semiconductor and component products are sold to manufacturers of electronic components and are used to drill, cut, trim, ablate and test. The Companys micromachining products are sold to manufacturers of end devices across multiple industries and are used to drill, cut or mark features on a range of materials, generally on the casing or external surface of the end device. The Companys integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials.