Price Target Update on Lam Research Corporation (NASDAQ:LRCX)

Lam Research Corporation (NASDAQ:LRCX) : Average target price received by Lam Research Corporation (NASDAQ:LRCX) is $93.78 with an expected standard deviation of $4.58. The most aggressive target on the stock is $100, whereas the most downbeat target is $85. 9 financial analysts are currently covering the stock.

Other Equity analysts have also commented on the company shares. RBC Capital initiates coverage on Lam Research Corporation (NASDAQ:LRCX) The brokerage firm has issued a Outperform rating on the shares. The Analysts at the ratings agency announces the price target to $92 per share. The rating by the firm was issued on March 16, 2016.

Lam Research Corporation (NASDAQ:LRCX): stock turned positive on Thursday. Though the stock opened at $86.28, the bulls momentum made the stock top out at $87.19 level for the day. The stock recorded a low of $86.15 and closed the trading day at $87.18, in the green by 1.79%. The total traded volume for the day was 2,606,873. The stock had closed at $85.65 in the previous days trading.

The company shares have rallied 2.29% from its 1 Year high price. On Jun 22, 2016, the shares registered one year high at $85.89 and the one year low was seen on Sep 24, 2015. The 50-Day Moving Average price is $79.59 and the 200 Day Moving Average price is recorded at $76.71. On the companys insider trading activities, According to the information disclosed by the Securities and Exchange Commission in a Form 4 filing, the officer (President and CEO) of Lam Research Corp, Anstice Martin B had sold 7,948 shares worth of $587,357 in a transaction dated October 26, 2015. In this transaction, 7,948 shares were sold at $73.9 per share.

Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.

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