Tessera Technologies Inc (TSRA): Richard Hill , director of Tessera Technologies Inc sold 25,000 shares on Jun 13, 2016. The Insider selling transaction was reported by the company on Jun 15, 2016 to the Securities and Exchange Commission. The shares were sold at $32.12 per share for a total value of $802,268.94 , the company said in a SEC Form 4 Filing.
Other Insider transactions have been reported by the company according to SEC Form 4, on Mar 9, 2015, George Cwynar (director) sold 3,516 shares at $39.72 per share price.On Mar 3, 2015, Peter A Feld (director) sold 375,000 shares at $41.08 per share price.Also, On Feb 18, 2015, Timothy J Stultz (director) sold 14,493 shares at $39.22 per share price.On Feb 13, 2015, Thomas A Lacey (CEO) sold 100,907 shares at $39.59 per share price.
Shares of Tessera Technologies (TSRA) ended Wednesday, Jun 15, 2016 session in red amid volatile trading. The shares closed down -0.38 points or -1.19% at $31.67 with 2,28,025 shares getting traded. Post opening the session at $32.17, the shares hit an intraday low of $31.65 and an intraday high of $32.2 and the price vacillated in this range throughout the day. The company has a market cap of $1,552 M and the number of outstanding shares has been calculated to be 4,90,10,159 shares. The 52-week high of Tessera Technologies is $39.95 and the 52-week low is $26.21.
Tessera Technologies Inc. is a holding company. The Company operates its business through its subsidiaries which include Invensas Corporation (Invensas) which is engaged in semiconductor interconnect innovation and intellectual property licensing and FotoNation Limited (FotoNation) which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions and products and solutions for mobile and imaging including its LifeFocus FaceTools FacePower FotoSavvy DigitalAperture face beautification red-eye removal high dynamic range autofocus panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Companys 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.