KLA-Tencor Corporation (NASDAQ:KLAC) has been under a strong bear grip, hence the stock is down -0.13% when compared to the S&P 500 in the past 4 weeks. However, in the near-term, buying emerged at lower levels and the stock has outperformed the S&P 500 by 0.44% in the past 1 week. The stock has continued its bullish performance both in the near-term and the medium-term, as the stock is up 1.72% in the last 1 week, and is up 1.49% in the past 4 weeks. Buying continues as the stock moves higher, suggesting a strong appetite for the stock.
The company shares have rallied 30.95% from its 1 Year high price. On Jun 23, 2016, the shares registered one year high at $75.17 and the one year low was seen on Aug 24, 2015. The 50-Day Moving Average price is $72.61 and the 200 Day Moving Average price is recorded at $69.64.
The stock has recorded a 20-day Moving Average of 1.25% and the 50-Day Moving Average is 3.35%.
KLA-Tencor Corporation (NASDAQ:KLAC): stock turned positive on Friday. Though the stock opened at $72.41, the bulls momentum made the stock top out at $73.9 level for the day. The stock recorded a low of $72.34 and closed the trading day at $73.75, in the green by 2.09%. The total traded volume for the day was 839,294. The stock had closed at $72.24 in the previous days trading.
In an insider trading activity,The officer (EVP & Chief Financial Officer) of Kla Tencor Corp, Higgins Bren D. sold 363 shares at $72.23 on July 5, 2016. The Insider selling transaction had a total value worth of $26,219. The Insider information was disclosed with the Securities and Exchange Commission in a Form 4 filing.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.