Kla Tencor Corp (KLAC): Bren D. Higgins , EVP & Chief Financial Officer of Kla Tencor Corp sold 363 shares on Jul 5, 2016. The Insider selling transaction was reported by the company on Jul 7, 2016 to the Securities and Exchange Commission. The shares were sold at $72.23 per share for a total value of $26,219.49 , the company said in a SEC Form 4 Filing.
Other Insider transactions have been reported by the company according to SEC Form 4, on May 6, 2016, Bobby R Bell (Executive Vice President) sold 6,343 shares at $69.18 per share price.On Feb 10, 2016, Brian M. Trafas (SVP, Global Customer Org.) sold 3,057 shares at $64.60 per share price.Also, On Feb 10, 2016, Michael Kirk (Executive Vice President) sold 3,844 shares at $64.60 per share price.On Jan 7, 2016, Virendra A Kirloskar (SVP & Chief Accounting Officer) sold 82 shares at $68.38 per share price.
Shares of KLA-Tencor Corp (KLAC) ended Tuesday, Jul 6, 2016 session in red amid volatile trading. The shares closed down -0.39 points or -0.54% at $72.11 with 12,23,996 shares getting traded. Post opening the session at $72.23, the shares hit an intraday low of $71.68 and an intraday high of $72.36 and the price vacillated in this range throughout the day. The company has a market cap of $11,228 M and the number of outstanding shares has been calculated to be 15,57,08,390 shares. The 52-week high of KLA-Tencor Corp is $75.17 and the 52-week low is $44.95.
Company has been under the radar of several Street Analysts.KLA-Tencor Corp is Reiterated by Cowen to Market Perform and the brokerage firm has raised the Price Target to $ 70 from a previous price target of $67 .The Rating was issued on Apr 27, 2016.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company’s products are also used in various other industries including the light emitting diode (LED) and data storage industries as well as general materials research. KLA-Tencor’s products and services are used by bare wafer integrated circuit (IC) lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness surface topography and composition measurements; measurement of in-chamber process conditions wafer shape and stress metrology; computational lithography tools and overall yield and fab-wide data management and analysis systems.