KLA-Tencor Corporation (KLAC): Price Target and June Short Interest Disclosure

KLA-Tencor Corporation (KLAC) : 5 investment research analysts covering KLA-Tencor Corporation (KLAC) have an average price target of $67.6 for the near short term. The highest target price given by the Brokerage Firm to the stock is $72 and the lowest target is $59 for the short term. Analysts expect the variance to be within $5.59 of the average price.

KLA-Tencor Corporation (KLAC) encountered a drop of 12.1% or -260,419 shares in the short positions. The number dropped from 2,145,369 on June 15,2016 to 1,884,950 on June 30,2016. The final interest is 1.2% of the floated stock. The days to cover figure of 1 can be arrived using the average daily exchange of 1,500,402 shares. The information was released by Financial Industry Regulatory Authority, Inc (FINRA) on June 12th.


KLA-Tencor Corporation (NASDAQ:KLAC): On Thursdays trading session , Opening price of the stock was $76 with an intraday high of $76.1. The bears continued to sell at higher levels and eventually sold the stock down to an intraday low of $74.87. However, the stock managed to close at $75.22, a loss of 0.44% for the day. On the previous day, the stock had closed at $75.55. The total traded volume of the day was 1,854,248 shares.

KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.

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