Nanometrics Inc (NANO): Stanislaw M. Borowicz , Senior VP, Sales of Nanometrics Inc sold 1,195 shares on Jul 1, 2016. The Insider selling transaction was reported by the company on Jul 6, 2016 to the Securities and Exchange Commission. The shares were sold at $20.52 per share for a total value of $24,521.40 , the company said in a SEC Form 4 Filing.
Other Insider transactions have been reported by the company according to SEC Form 4, on Jul 6, 2016, Bruce C Rhine (director) sold 10,000 shares at $20.51 per share price.On Jun 17, 2016, Stanislaw M. Borowicz (Senior VP, Sales) sold 209 shares at $18.68 per share price.Also, On Apr 4, 2016, Kevin Heidrich (Senior VP, Marketing) sold 20,000 shares at $15.41 per share price.On Aug 12, 2015, Timothy J Stultz (President & CEO) sold 11,111 shares at $14.53 per share price.
Shares of Nanometrics Incorporated (NANO) ended Tuesday, Jul 6, 2016 session in red amid volatile trading. The shares closed down -0.13 points or -0.63% at $20.46 with 1,15,496 shares getting traded. Post opening the session at $20.39, the shares hit an intraday low of $20.2101 and an intraday high of $20.53 and the price vacillated in this range throughout the day. The company has a market cap of $499 M and the number of outstanding shares has been calculated to be 2,43,99,157 shares. The 52-week high of Nanometrics Incorporated is $20.87 and the 52-week low is $11.91.
Company has been under the radar of several Street Analysts.Nanometrics Incorporated is Reiterated by Stifel to Buy and the brokerage firm has raised the Price Target to $ 25 from a previous price target of $21 .The Rating was issued on Jun 27, 2016.Nanometrics Incorporated is Reiterated by The Benchmark Company to Buy and the brokerage firm has raised the Price Target to $ 24 from a previous price target of $18.50 .The Rating was issued on Apr 27, 2016.
Nanometrics Incorporated (Nanometrics) provides process control metrology and inspection systems used in the fabrication of integrated circuits high-brightness LEDs (HB-LED) discrete components and data storage devices. The Company’s automated and integrated systems address numerous process control applications including critical dimension and film thickness measurement device topography defect inspection and analysis of various other film properties such as optical electrical and material characteristics. The Company’s process control solutions are deployed throughout the fabrication process from front-end-of-line substrate manufacturing to high-volume production of semiconductors and other devices to advanced wafer-scale packaging applications. The Company offers a diverse line of process control and inspection products and technologies to address the manufacturing requirements of the semiconductor (and other solid state device) manufacturing industry.