Lam Research Corporation (LRCX) : Traders are bullish on Lam Research Corporation (LRCX) as it has outperformed the S&P 500 by a wide margin of 2.36% in the past 4 weeks. The bullishness in the stock continues even in the near-term as the stock has returned an impressive 2.79%, relative to the S&P 500. The stock has continued its bullish performance both in the near-term and the medium-term, as the stock is up 4.32% in the last 1 week, and is up 6.83% in the past 4 weeks. Buying continues as the stock moves higher, suggesting a strong appetite for the stock. The stock has recorded a 20-day Moving Average of 5.27% and the 50-Day Moving Average is 9.55%.
Lam Research Corporation (NASDAQ:LRCX): During Fridays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $88.19 and $87.63 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $88.84. The buying momentum continued till the end and the stock did not give up its gains. It closed at $88.55, notching a gain of 0.76% for the day. The total traded volume was 1,834,054 . The stock had closed at $87.88 on the previous day.
The company Insiders own 0.43% of Lam Research Corporation shares according to the proxy statements. In a related news, The officer (President and CEO), of Lam Research Corp, Anstice Martin B had unloaded 7,948 shares at $73.9 per share in a transaction on October 26, 2015. The total value of transaction was $587,357. The Insider information was revealed by the Securities and Exchange Commission in a Form 4 filing.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.