Lam Research Corporation (LRCX) : On Friday, The money flowed into the Lam Research Corporation (LRCX) stock with an uptick to downtick ratio was recorded at 1.76. Transactions worth $3.14 million were done on upticks, confirming the buying interest in the stock. The outflow of money on downticks stood at $1.79 million. The total money flow into the stock was $1.35 million. The investors are using every small weakness in the stock to accumulate it, as can be seen in the $1.7 million of block transactions on upticks. The total money flow in block trades was $1.7 million. In terms of price action, Lam Research Corporation (LRCX) traded down $0.11 during the session at $89.22. Compared to the previous days closing, the stock was down only by -0.12%. For the week, the stock is 0.75%, over previous weeks closing.
Lam Research Corporation (LRCX) : The highest level Lam Research Corporation (LRCX) is projected to reach is $100 for the short term and the lowest estimate is at $85. The consolidated price target from 10 rating analysts who initiate coverage on the stock is $93.9 and the possibility the share price can swing is $4.33.
Lam Research Corporation (NASDAQ:LRCX): stock turned positive on Friday. Though the stock opened at $89.69, the bulls momentum made the stock top out at $90.34 level for the day. The stock recorded a low of $88.99 and closed the trading day at $90.05, in the green by 0.82%. The total traded volume for the day was 1,280,295. The stock had closed at $89.32 in the previous days trading.
In a related news,The officer (President and CEO) of Lam Research Corp, Anstice Martin B sold 7,948 shares at $73.9 on October 26, 2015. The Insider selling transaction had a total value worth of $587,357. The Insider information was disclosed with the Securities and Exchange Commission in a Form 4 filing.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.