Shares of Lam Research Corporation (LRCX) Sees Large Outflow of Money

Lam Research Corporation (LRCX) : The total money flow in Lam Research Corporation (LRCX) was negative ($11.66 million), showing the domination of sellers in the Wednesday trading session. The traders utilized every rise to sell their positions, as seen in the value of trading on downtick to the tune of $53.4 million. Transactions on upticks were comparatively lower at $41.74 million. The uptick to downtick ratio was 0.78. The total block trades done on upticks were valued at $9.39 million. The total block trades on downticks were valued at $22.29 million. The uptick to the downtick ratio of block trades was 0.42. The money flow during block trades was negative ($12.9 million) when the stock traded with a gain of $171 cent. Lam Research Corporation (LRCX) was $91.21, an increase of 1.91% over the previous days close.


Lam Research Corporation (NASDAQ:LRCX): During Wednesdays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $90.00 and $89.46 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $91.50. The buying momentum continued till the end and the stock did not give up its gains. It closed at $91.21, notching a gain of 1.91% for the day. The total traded volume was 2,536,375 . The stock had closed at $89.50 on the previous day.

The stock has recorded a 20-day Moving Average of 7.31% and the 50-Day Moving Average is 11.64%. In a related news, The officer (President and CEO), of Lam Research Corp, Anstice Martin B had unloaded 7,948 shares at $73.9 per share in a transaction on October 26, 2015. The total value of transaction was $587,357. The Insider information was revealed by the Securities and Exchange Commission in a Form 4 filing.

Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.

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