Lam Research Corporation (NASDAQ:LRCX) : Average target price received by Lam Research Corporation (NASDAQ:LRCX) is $93.9 with an expected standard deviation of $4.33. The most aggressive target on the stock is $100, whereas the most downbeat target is $85. 10 financial analysts are currently covering the stock.
Lam Research Corporation has dropped 3.58% in the last five trading days, however, the shares have posted positive gains of 1.49% in the last 4 weeks. Lam Research Corporation is up 1.73% in the last 3-month period. Year-to-Date the stock performance stands at 6.66%.
Lam Research Corporation (NASDAQ:LRCX) has an average broker rating of 1, which is interpreted as a Strong Buy, as rated by 10 equity analysts. Nonetheless, 10 analysts are positive on the stocks future and they recommend a Strong Buy on the stock. Ranking by Zacks Investment Research for Coach Inc is 4, which is also a Sell.
Lam Research Corporation (NASDAQ:LRCX): During Thursdays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $82.81 and $82.18 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $84.06. The buying momentum continued till the end and the stock did not give up its gains. It closed at $84.06, notching a gain of 2.26% for the day. The total traded volume was 2,845,627 . The stock had closed at $82.20 on the previous day.
In an insider trading activity,The officer (President and CEO) of Lam Research Corp, Anstice Martin B sold 7,948 shares at $73.9 on October 26, 2015. The Insider selling transaction had a total value worth of $587,357. The Insider information was disclosed with the Securities and Exchange Commission in a Form 4 filing.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.