Tessera Technologies (TSRA) : Freestone Capital Holdings scooped up 25,150 additional shares in Tessera Technologies during the most recent quarter end , the firm said in a disclosure report filed with the SEC on Aug 10, 2016. The investment management firm now holds a total of 596,967 shares of Tessera Technologies which is valued at $19,270,095.Tessera Technologies makes up approximately 1.79% of Freestone Capital Holdings’s portfolio.
Other Hedge Funds, Including , Segall Bryant Hamill boosted its stake in TSRA in the latest quarter, The investment management firm added 44,498 additional shares and now holds a total of 1,018,011 shares of Tessera Technologies which is valued at $32,861,395. Tessera Technologies makes up approx 0.83% of Segall Bryant Hamill’s portfolio. Nine Chapters Capital Management sold out all of its stake in TSRA during the most recent quarter. The investment firm sold 38,700 shares of TSRA which is valued $1,240,335.
Tessera Technologies closed down -0.17 points or -0.52% at $32.84 with 3,88,666 shares getting traded on Friday. Post opening the session at $33.03, the shares hit an intraday low of $32.81 and an intraday high of $33.3 and the price fluctuated in this range throughout the day.Shares ended Friday session in Red.
On the company’s financial health, Tessera Technologies reported $0.60 EPS for the quarter, beating the analyst consensus estimate by $ 0.04 according to the earnings call on Aug 2, 2016. Analyst had a consensus of $0.56. The company had revenue of $67.02 million for the quarter, compared to analysts expectations of $65.17 million. The company’s revenue was up 4.4% compared to the same quarter last year. During the same quarter in the previous year, the company posted $0.58 EPS.
Tessera Technologies Inc. is a holding company. The Company operates its business through its subsidiaries which include Invensas Corporation (Invensas) which is engaged in semiconductor interconnect innovation and intellectual property licensing and FotoNation Limited (FotoNation) which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions and products and solutions for mobile and imaging including its LifeFocus FaceTools FacePower FotoSavvy DigitalAperture face beautification red-eye removal high dynamic range autofocus panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Companys 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.