Lam Research Corporation (LRCX) : Money flow in the Lam Research Corporation (LRCX) stock was negative (1.5 million) on Monday, which shows that the investors used the strength in the stock price to reduce their holdings. The total traded value on upticks was $5.52 million, compared to $7.01 million on downticks. The total uptick to downtick ratio was 0.79, indicating the underlying weakness in the stock. Even in block trades, money flow was negative ($1.55 million), indicating selling on the strength. Downtick transaction value in block trades amounted to $1.55 million, indicating persistent selling. Lam Research Corporation (LRCX) traded $0.82 higher at $90 gaining 0.92% over the previous days close.
Lam Research Corporation has dropped 2.14% in the last five trading days, however, the shares have posted positive gains of 2.47% in the last 4 weeks. Lam Research Corporation is up 23.97% in the last 3-month period. Year-to-Date the stock performance stands at 15.13%.
Lam Research Corporation (NASDAQ:LRCX): During Mondays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $89.17 and $89.10 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $91.37. The buying momentum continued till the end and the stock did not give up its gains. It closed at $90.74, notching a gain of 1.75% for the day. The total traded volume was 2,124,021 . The stock had closed at $89.18 on the previous day.
In a related news, The officer (President and CEO), of Lam Research Corp, Anstice Martin B had unloaded 7,948 shares at $73.9 per share in a transaction on October 26, 2015. The total value of transaction was $587,357. The Insider information was revealed by the Securities and Exchange Commission in a Form 4 filing.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.