Tessera Technologies (TSRA) : Traders are getting increasingly bearish on Tessera Technologies (TSRA), as can be seen in the addition of short positions from 2,414,822 on Jul 29, 2016, to 2,533,131 on August 15, 2016. The net change in shorts is 118,309 shares, an increase of 4.9%. 6 days remain before the expiry. The 5.3% of outstanding short positions on the stock compared to its float, shows that traders expect the stock to fall from the current levels. The daily volume of the stock is 459,765. The short interest information was released on Wednesday Aug 24th after the market close.
Tessera Technologies (NASDAQ:TSRA): During Wednesdays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $33.34 and $33.19 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $33.43. The buying momentum continued till the end and the stock did not give up its gains. It closed at $33.29, notching a gain of 0.06% for the day. The total traded volume was 415,704 . The stock had closed at $33.27 on the previous day.
In a related news, The director, of Tessera Technologies Inc, Riedel George Andrew had unloaded 4,500 shares at $32.68 per share in a transaction on August 17, 2016. The total value of transaction was $147,060. The Insider information was revealed by the Securities and Exchange Commission in a Form 4 filing.
Tessera Technologies, Inc. is a holding company. The Company operates its business through its subsidiaries, which include Invensas Corporation (Invensas), which is engaged in semiconductor interconnect innovation and intellectual property licensing, and FotoNation Limited (FotoNation), which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions, and products and solutions for mobile and imaging, including its LifeFocus, FaceTools, FacePower, FotoSavvy, DigitalAperture, face beautification, red-eye removal, high dynamic range, autofocus, panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Companys 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.