Siliconware Precision Industries Company Ltd. (SPIL) Shares are Down -0.39%

Siliconware Precision Industries Company Ltd. (SPIL) has risen sharply, recording gains of 1.47% in the past 4 weeks. However, the stock has corrected -0.39% in the past 1 week, providing a good buying opportunity on dips. On a relative basis, the stock has outperformed the S&P 500 by 1.09% in the past 4 weeks, but has underperformed the S&P 500 in the past 1 week.

Siliconware Precision Industries Co. Ltd. is up 10.83% in the last 3-month period. Year-to-Date the stock performance stands at -2.32%. The stock has recorded a 20-day Moving Average of 0.41% and the 50-Day Moving Average is 0.07%.


Siliconware Precision Industries Company Ltd. (NASDAQ:SPIL): The stock opened at $7.56 on Friday but the bulls could not build on the opening and the stock topped out at $7.59 for the day. The stock traded down to $7.53 during the day, due to lack of any buying support eventually closed down at $7.57 with a loss of -0.79% for the day. The stock had closed at $7.63 on the previous day. The total traded volume was 120,133 shares.

Also, Citigroup downgrades its rating on Siliconware Precision Industries Company Ltd. (NASDAQ:SPIL). Analysts at the Citigroup have a current rating of Neutral on the shares. The shares were previously rated Buy. The rating by the firm was issued on April 27, 2016.

Siliconware Precision Industries Co., Ltd. is an independent provider of semiconductor packaging and testing services. The Company offers packaging and testing solutions, including advanced packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. It also offers its customers turnkey service, from packaging and testing to shipment service. It focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. It develops advanced packaging technologies, such as flip-chip and wafer bumping technologies. It provides testing services, such as wafer probing, final testing, tooling design and other testing services. It provides final testing services for a range of logic and mixed signal and radio frequency integrated circuit packages and other integrated circuit packages, including complex and high-performance integrated circuits, as well as lower-performance ones.

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