Siliconware Precision Industries Company Ltd. (SPIL) Shares are Up 2.15%

Siliconware Precision Industries Company Ltd. (SPIL) has been under a strong bear grip, hence the stock is down -1.39% when compared to the S&P 500 in the past 4 weeks. However, in the near-term, buying emerged at lower levels and the stock has outperformed the S&P 500 by 1.72% in the past 1 week. The stock has continued its bullish performance both in the near-term and the medium-term, as the stock is up 2.15% in the last 1 week, and is up 1.06% in the past 4 weeks. Buying continues as the stock moves higher, suggesting a strong appetite for the stock.

Siliconware Precision Industries Company Ltd. (NASDAQ:SPIL): During Fridays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $7.57 and $7.56 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $7.60. The buying momentum continued till the end and the stock did not give up its gains. It closed at $7.60, notching a gain of 0.40% for the day. The total traded volume was 171,701 . The stock had closed at $7.57 on the previous day.

The stock has recorded a 20-day Moving Average of 1.75% and the 50-Day Moving Average is 0.85%. Siliconware Precision Industries Co. Ltd. is up 13.94% in the last 3-month period. Year-to-Date the stock performance stands at -1.94%.


Siliconware Precision Industries Co., Ltd. is an independent provider of semiconductor packaging and testing services. The Company offers packaging and testing solutions, including advanced packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. It also offers its customers turnkey service, from packaging and testing to shipment service. It focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. It develops advanced packaging technologies, such as flip-chip and wafer bumping technologies. It provides testing services, such as wafer probing, final testing, tooling design and other testing services. It provides final testing services for a range of logic and mixed signal and radio frequency integrated circuit packages and other integrated circuit packages, including complex and high-performance integrated circuits, as well as lower-performance ones.

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