KLA-Tencor Corporation (KLAC) : Traders are bullish on KLA-Tencor Corporation (KLAC) as it has outperformed the S&P 500 by a wide margin of 1.03% in the past 4 weeks. The bullishness in the stock continues even in the near-term as the stock has returned an impressive 0.62%, relative to the S&P 500. The stock has risen by 1.15% in the past week indicating that the buyers are active at lower levels, but the stock is down -1.01% in the past 4 weeks.
The stock has recorded a 20-day Moving Average of 1.15% and the 50-Day Moving Average is 2.75%.The 200 Day SMA reached 1.32% KLA-Tencor Corporation has dropped 3.11% during the last 3-month period . Year-to-Date the stock performance stands at 3.64%.
KLA-Tencor Corporation (KLAC) : 5 Wall Street analysts covering KLA-Tencor Corporation (KLAC) believe that the average level the stock could reach for the short term is $72. The maximum price target given is $80 and the minimum target for short term is around $59, hence the standard deviation is calculated at $9.41.
Company shares have received an average consensus rating of Hold for the current week KLA-Tencor Corporation (NASDAQ:KLAC): stock was range-bound between the intraday low of $69.43 and the intraday high of $70.4 after having opened at $70.09 on Fridays session. The stock finally closed in the red at $70.09, a loss of -0.04%. The stock remained in the red for the whole trading day. The total traded volume was 1,514,794 shares. The stock failed to cross $70.4 in Fridays trading. The stocks closing price on Thursday was $70.26.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.