Lam Research Corporation (LRCX) : 13 investment research analysts covering Lam Research Corporation (LRCX) have an average price target of $101.23 for the near short term. The highest target price given by the Brokerage Firm to the stock is $110 and the lowest target is $85 for the short term. Analysts expect the variance to be within $7.53 of the average price.
Lam Research Corporation (LRCX) : The consensus on Lam Research Corporation (LRCX) based on 12 analyst recommendation on the company stock is 1.25, which is interpreted as a Strong Buy recommendation. Zacks Investment Research has issued a rank of 3 which endorses a Hold on the stock. However, 10 brokers have a differing view as they consider the stock to be a Strong Buy at current levels. 1 analyst believes that the stock is a Buy, which can produce decent returns in the future. 1 experts consider that the stocks earnings and the quoted price is in harmony, hence, they give it a Hold rating.
Also, Brokerage firm Citigroup maintains its rating on Lam Research Corporation (NASDAQ:LRCX). As per the latest information, the brokerage house lowers the price target to $102 per share from a prior target of $105. The shares have been rated Buy. The rating by the firm was issued on August 12, 2016.
Lam Research Corporation (NASDAQ:LRCX): During Thursdays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $93.60 and $92.79 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $94.77. The buying momentum continued till the end and the stock did not give up its gains. It closed at $94.63, notching a gain of 1.40% for the day. The total traded volume was 1,899,987 . The stock had closed at $93.32 on the previous day.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.